- Manufacturer:
-
- CTS Corporation (1)
- CUI Devices (2)
- Attachment Method:
-
- Material:
-
- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Shape:
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- Thermal Resistance @ Natural:
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7 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Buy Now Get Quote | ||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
35,000
In-stock
|
Buy Now Get Quote | ||
![]() |
CTS Corporation | HEATSINK FORGED ... |
35,000
In-stock
|
Buy Now Get Quote | ||
![]() |
TE Connectivity AMP Connectors | 32.5MM HS ASSY ULTE |
35,000
In-stock
|
Get Quote | ||
![]() |
TE Connectivity AMP Connectors | 2 FINS,2.000 OD HS W/... |
35,000
In-stock
|
Get Quote | ||
![]() |
TE Connectivity AMP Connectors | 2 FINS,2.000 OD HS W/... |
35,000
In-stock
|
Get Quote | ||
![]() |
TE Connectivity AMP Connectors | 2 FINS,2.000 OD HS W/... |
35,000
In-stock
|
Get Quote |