- Manufacturer:
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- Cooling Source (1)
- CUI Devices (1)
- Attachment Method:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Type:
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5 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
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Cooling Source | 25X25 X20MM |
35,000
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEATSINK TO-220 2.9W... |
35,000
In-stock
|
Buy Now Get Quote | ||
![]() |
Wakefield Thermal | HEAT SINK PIN FIN... |
35,000
In-stock
|
Buy Now Get Quote | ||
![]() |
TE Connectivity AMP Connectors | 2 FINS, 2.00 OD HS W/... |
35,000
In-stock
|
Get Quote | ||
![]() |
TE Connectivity AMP Connectors | 2 FINS, 2.000 OD HS W... |
35,000
In-stock
|
Get Quote |