- Manufacturer：
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- CUI Devices (3)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
3,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,577
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,582
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 45MM X 45... |
65
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
72
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 42.5 X 42.5... |
37
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 42.5X42.5X9... |
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 45X45X9.5M... |
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X19.5M... |
35,000
In-stock
|
Buy Now Get Quote |
